Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.
1～30 item / All 45 items
Super engineering plastic with excellent heat resistance, wear resistance, and electrical insulation properties.
MELDIN 7001 series is a fully aromatic polyimide resin that maintains excellent heat resistance and outstanding mechanical properties. It can be used at 482°C for short periods of time. Additionally, it excels in wear resistance, creep resistance, and electrical insulation.
Continuous use at high temperatures of 315℃ is possible! High-performance heat-resistant resin polyimide. Free PDF materials with case studies and physical property data.
The "MELDIN 7000 Series" is a high-performance heat-resistant resin that can be continuously used at high temperatures of 315°C. It is resistant to wear and possesses excellent mechanical properties at high temperatures. It has low elution of metal ions and minimal outgassing, and it excels in electrical insulation as well as resistance to solvents, grease, and oil. It has already demonstrated numerous applications in semiconductors, FPDs, and vacuum equipment. We are currently offering a PDF document that provides actual case studies and physical property data as a gift. ■ Please see below for application details ■
Purely made in Japan PI (polyimide) resin. We propose a stable supply of PI components!
Polyimide (PI) natural grade material compressed and molded using the PBI method for machining applications. It possesses excellent heat resistance, mechanical strength, electrical insulation, and chemical resistance, making it ideal for use in harsh environments. It is utilized in a wide range of fields, including aerospace, automotive, and electronic components.
Excellent heat resistance with a continuous use temperature of 288°C. Outgassing is also reduced. Material property table and price list are being distributed [Remote consultations are also available].
"Besper" is a DuPont manufactured fully aromatic polyimide resin that boasts exceptional heat resistance, capable of supporting high loads without softening even at high temperatures. In addition to "SP-1," which is made of 100% polyimide resin and excels in mechanical strength and electrical and thermal insulation properties, we offer a variety of grades that can be selected based on application needs, including sliding properties, static elimination performance, and dimensional stability under high loads. 【Features】 ■ Continuous use temperature is 288°C, intermittent use temperature is 480°C ■ Low outgassing, making it suitable for environments requiring high cleanliness, such as the semiconductor field ■ Prevents damage to transported items when used in transport rollers ■ "SP-1" can be used for insulation parts, insulating components, valves, glass substrates, lenses, bearings, transport suction nozzles, seal rings, and plasma-resistant parts. *We are currently publishing a property table that includes "SP-1" and "SCP-5000 (high strength and chemical resistance)," as well as a price list for "SP-1" and "SP-202 (static elimination grade)." You can view it via “PDF download.” Please feel free to contact us with any inquiries.
Material for machining processed by compression molding of PI.
The "6000 Series" is a machining material made from compressed PI (polyimide). PI resin has high mechanical strength and excellent heat resistance, electrical insulation, and chemical resistance, making it widely used in aerospace, automotive, and electrical and electronic fields. 【Features】 ■ Excellent mechanical properties ■ High heat resistance ■ Glass transition temperature: ~335°C ■ Load deflection temperature: ~320°C *For more details, please refer to the PDF materials on the official website or feel free to contact us.
Polyimide resin, which is expected to be utilized in various fields including 5G-related applications and aerospace. Product materials are being provided.
Our company will be exhibiting at "Chemical Materials Japan 2020," which will be held online from October 19 to November 18, 2020. 【Exhibited Products Features】 ■ Thermoplastic Polyimide Resin 'Supreme TO65' - Excellent moldability with a Tg of 185°C and a Tm of 323°C - Suitable for various applications such as melt-extruded films, machining, and injection molding ■ Heat-Resistant Transparent Polyester Resin 'ALTESTER Series' - Developed a new grade with a glass transition temperature up to 50°C higher than PET - Currently developing a new grade with crystallinity - Maintains transparency while improving impact resistance ■ Thermosetting Resin 'CYTESTER' - Cures by forming a triazine ring Excellent processability, with high glass transition temperature, low thermal expansion, and low dielectric properties after curing ■ Special Polyol 'SPG (Spiroglycol)' - Symmetrical and stable molecular structure - Incorporating into polymers enhances heat resistance, impact resistance, hardness, and moldability ■ Special Polyol 'DOG (Dioxanediol)' - Can impart flexibility when incorporated into polymers *For more details about each product, please refer to the materials or feel free to contact us.
A thermoplastic polyimide resin that combines unprecedented moldability and heat resistance.
"Suprem" is a thermoplastic polyimide resin that exhibits a balanced glass transition temperature (Tg 185°C) and melting point (Tm 323°C) compared to super engineering plastics such as PEEK and PEKK, and combines high strength, high heat resistance, high solvent resistance, low dielectric constant (2.66 at 10GHz), and easy moldability. It is a crystalline TPI that maintains a high glass transition temperature while lowering the melting point, and it has a wide range of applications such as CFRP matrix resin, CFRP toughness modifiers, compounds, and electrical and electronic uses, leveraging its characteristics. [Features] ■ Crystalline thermoplastic polyimide (pellets, powder) ■ Insoluble in solvents ■ High heat resistance, high strength ■ Easy moldability ■ Reflow resistant ■ Low dielectric, high lubricity *For more details, please refer to the PDF document or feel free to contact us.
Introducing examples of film molding of Surprim, boasting low dielectric properties and high toughness, with Tg of 185°C and Tm of 323°C!
Here is an introduction to examples of film molding using "Saprime." "Saprime" is a thermoplastic polyimide resin that exhibits a balanced glass transition temperature (Tg 185°C) and melting point (Tm 323°C) compared to super engineering plastics such as PEEK and PEKK. It combines high strength, high heat resistance, high solvent resistance, low dielectric constant (2.66 at 10GHz), and easy moldability. It is a crystalline TPI that maintains a high glass transition temperature while lowering the melting point, making it suitable for a wide range of applications such as CFRP matrix resins, CFRP toughness modifiers, compounds, and electrical and electronic applications. 【Features】 ■ Low dielectric properties ■ Low water absorption ■ High visibility ■ High toughness ■ High Tg (185°C) ■ Crystalline film *For more details, please refer to the PDF materials or feel free to contact us.
For complex shape members and high-performance molded members!
Introducing the crystalline thermoplastic polyimide "Therplim Fiber Reinforced Grade". It is suitable for applications that require high Tg (185℃) as an alternative to super engineering plastics such as PEEK.
Heat-resistant and insulating coating / film forming, polyimide varnish "Payer M.L."
Polyimide resin was developed by DuPont in the 1960s and has since been widely used, ranging from advanced materials for space development to everyday electrical and electronic devices. The resin's excellent thermal stability, mechanical and electrical properties, and high reliability are backed by years of proven performance, and its applications continue to expand today. Our company acquired the manufacturing and sales rights for the coating-forming varnish, Pylar M.L., from DuPont in 1994, and it is still produced at I.S.T (USA) within the DuPont facility in Parlin, NJ, supplying customers worldwide. Pylar M.L. is a polyamic acid solution (polyimide precursor) formed by the polycondensation reaction of aromatic diamines and anhydrides. By coating with Pylar M.L. as the base material and drying and curing at high temperatures, a polyimide coating with excellent properties can be obtained.
Recycled polyimide resin that achieves a high imidization rate while being a recycled product.
"Polyimide powder" is a polyimide powder produced through chemical treatment, heating treatment, and sintering processes of aromatic polyimide film scraps. Despite being a recycled product, it achieves a high imidization rate. We propose it as a viable material, not just as a material under consideration. 【Features】 ■ Offered at an easily accessible price range ■ Proposed as a viable material ■ Depending on the inquiry, free samples (200g) may be available ■ Aiming for SDGs (Sustainable Development Goals) Please also watch the video (in English) https://youtu.be/xaaslYfetvE *Please feel free to contact us through our website.
Extremely low generation of outgassing! An engineering plastic with excellent heat resistance and wear resistance.
Our company manufactures precision press-formed products and handles a variety of materials. "Kapton (polyimide)" is a super engineering plastic that exhibits superior heat resistance and wear resistance compared to other engineering plastics. The continuous use temperature is 260°C, the load deflection temperature is 380°C, and it can be used at around 500°C for short periods. It contains very few impurities and has a very low outgassing characteristic due to its high purity. 【Features】 ■ Excellent heat resistance and wear resistance ■ Low impurity content ■ Minimal outgassing *For more details, please refer to the PDF document or feel free to contact us.
Biphenyl tetracarboxylic dianhydride (BPDA) and diamine condensation polymerization!
We would like to introduce the cutting processing material "PI resin (BPDA)" that we handle. It is an all-aromatic polyimide resin produced by the polycondensation of biphenyl tetracarboxylic acid dianhydride (BPDA) and diamines. The compression molding grades include "SCP-5000," which excels in dimensional stability under humid conditions, and "SCM8000," which has good wear resistance. 【Features of SCP-5000】 - Improved rigidity and impact strength compared to aromatic polyimide resin SP-1 - Enhanced long-term high-temperature exposure resistance (with a Tg point of 380°C) - Excellent dimensional stability under humid conditions *For more details, please refer to the related links or feel free to contact us.
![Precision machining of polyimide resin (PI resin) [SCM8000]](https://image.mono.ipros.com/public/product/image/659/2001485990/IPROS32746673134494526121.png?w=280&h=280)
We offer precision machining of the SCM8000 from PBI Corporation. We have a large inventory. From small lots of 1 piece to mass production!
The SCM8000 is a machining material made from ultra-high heat-resistant polyimide UPI natural grade, compressed and molded using the PBI method. It features ultra heat resistance, a load deflection temperature of up to 480°C, excellent mechanical properties, good wear resistance, low water absorption, and anti-static/conductive properties. We respond to customer needs with advanced processing technology tailored to the characteristics of PBI resin. 【Key physical properties at 23°C (partial)】 ■ Tensile strength: 100 MPa (Standard ISO 527) ■ Tensile strain: 2.0% (Standard ISO 527) ■ Flexural strength: 190 MPa (Standard ISO 178) ■ Flexural modulus: 7.0 GPa (Standard ISO 178) ■ Charpy impact strength (notched): 1.5 kJ/m² (Standard ISO 179) *You can view our available equipment by downloading the PDF. Please feel free to contact us for any other inquiries.
![Precision machining of polyimide resin (PI resin) [Sepra SA101]](https://image.mono.ipros.com/public/product/image/568/2001485992/IPROS68069795969186724702.png?w=280&h=280)
We offer precision machining of the ultra-heat-resistant polyimide molded product "Sepra" SA series from Suzukou Shoji. We have a large inventory available. From small lots of 1 piece to mass production!
The "Sepra SA101" is a polyimide molded body characterized by a high heat distortion temperature of 470°C compared to the standard grade Sepra. In addition, it possesses plasma resistance, low water absorption rate, and low outgassing properties, demonstrating effectiveness in applications such as liquid crystal and semiconductor manufacturing equipment. We respond to customer needs with advanced processing technology tailored to the characteristics of PI resin. 【Main Physical Properties (Partial)】 ■ Tensile Strength (Standard D-638) - Condition 23°C: 110 MPa - Condition 260°C: 47 MPa ■ Elongation (Standard D-638) - Condition 23°C: 4.0% - Condition 260°C: 3.0% *You can view the available equipment by downloading the PDF. Please feel free to contact us for any other inquiries.
![Precision machining of polyimide resin (PI resin) [Sepra SA201]](https://image.mono.ipros.com/public/product/image/2b9/2001485994/IPROS77567560051575489225.png?w=280&h=280)
We offer precision machining of the ultra-heat-resistant polyimide molded product "Sepra" SA series from Suzukiko Shoji. We have a large inventory available. From small lots of 1 piece to mass production!
The "Sepra SA201" is a grade of polyimide molding with a high performance, featuring a heat distortion temperature of 486°C, while also offering excellent cost performance, making it suitable for a wider range of applications. It is characterized by ultra-heat resistance (heat distortion temperature of 486°C), high vacuum properties, good machinability, and low impurity concentration. We respond to customer needs with advanced processing technology tailored to the characteristics of PI resin. 【Key Physical Properties】 ■ Tensile Strength: 72 MPa (Standard D-638) ■ Elongation: 4.4% (Standard D-638) ■ Flexural Strength: 109 MPa (Standard D-790) ■ Flexural Modulus: 4.3 GPa (Standard D-790) ■ Coefficient of Linear Expansion: 50 ppm/°C (Standard D-233) *You can view the available equipment by downloading the PDF. Please feel free to contact us for any other inquiries.
We will contribute to the industrial sector with advanced technology.
Design, development, manufacturing, and sales of functional soluble polyimide resin.
It is an engineering plastic that boasts excellent heat resistance, low water absorption rate, and outstanding sliding properties.
SCM8000 is a super heat-resistant resin made from high heat-resistant polyimide that has been compression molded. It exhibits excellent performance in high-temperature environments, corrosive conditions, and areas with concerns about wear due to repeated sliding. Among engineering plastics, it is a material with good processability. It allows for burr-free machining with cutting tools during drilling and is suitable for fine hole drilling. Our company has extensive experience in precision machining, so please feel free to consult with us. 【Features】 ■ Load deflection temperature: 480℃ ■ Low water absorption (23℃, 24h): 0.06wt% ■ Flexural strength: 190MPa ■ Replacement of high vacuum and high heat-resistant parts (ceramics ⇒ SCM8000, etc.) For more details, please refer to the materials. We would be happy to assist you.
Besper(R)
Bespel® is a high-heat-resistant plastic (fully aromatic polyimide resin) developed by DuPont. It has the best heat resistance and wear resistance among engineering plastics and is used in a wide range of applications, including mechanical and electrical components. 【Features】 1. Excellent heat resistance. It can be used continuously at 288°C and intermittently at 480°C. 2. Excellent wear resistance. The limit PV value is more than 10 times that of general plastics. 3. Excellent creep resistance. Creep at 260°C and 18.2MPa is only 0.6% after 1000 hours. 4. Excellent electrical properties. Insulation strength is 22KV/mm. 5. Additionally, it excels in plasma resistance, radiation resistance, gas release resistance (under vacuum), and chemical resistance.
![[Analysis Case] Structural Analysis of Polyimide Resin](https://image.mono.ipros.com/public/product/image/32d/2000262459/IPROS6779270322238354434.jpg?w=280&h=280)
Structural analysis of polyimide resin is possible using thermal decomposition GC/MS method.
Polyimide resin is excellent in heat resistance, chemical resistance, and toughness, and also has high insulation properties, making it used in various applications, including insulation materials for electronic devices. However, due to its almost non-existent solvent solubility, the analytical methods for structural determination are limited. This case introduces an example of thermal decomposition GC/MS measurement of commercially available polyimide resin. Multiple thermal decomposition products reflecting the polymer structure were observed in high-boiling components with long retention times, demonstrating that this method is a powerful means for structural determination.
Drive blendable! Micronized powder of heat-resistant polyimide resin that can also be processed by melting.
"Saprime" is a thermoplastic polyimide resin that demonstrates a balanced glass transition temperature (Tg 185°C) and melting point (Tm 323°C) compared to super engineering plastics such as PEEK and PEKK. It combines high strength, high heat resistance, high solvent resistance, low dielectric constant (2.66 at 10GHz), and easy moldability. It is a crystalline TPI that maintains a high glass transition temperature while lowering the melting point, making it suitable for a wide range of applications such as CFRP matrix resins, CFRP toughness modifiers, compounds, and electrical and electronic uses. "Saprime Powder" is a fine powder of heat-resistant polyimide resin. Despite being a fine particle, it has a uniform particle size and can be melt-formed above the melting point. [Features] - Crystalline thermoplastic polyimide - Insoluble in solvents - Fine powder with a sharp particle size distribution - Milky white powder - Can be drive blended - Low dielectric, high heat resistance, and meltable *For more details, please refer to the PDF document or feel free to contact us.
The Suprem Sliding Grade "TS2400W" achieves higher strength, elasticity, lower wear, and a lower dynamic friction coefficient than the PEEK sliding grade!
The Suprem TS series is a sliding grade for injection molding that uses Suprem as the base resin. The carbon fiber and whisker reinforced grades "TS2400W" and "TS2401W" have higher strength and elasticity than PEEK. 【Features】 ■ Low wear and low friction coefficient - In particular, "TS2400W" has lower wear and a lower dynamic friction coefficient than PEEK sliding grades. ■ Good stability of dynamic friction coefficient - Stable dynamic friction coefficient at 23°C and 120°C. ■ Good sliding properties even at high temperatures - "TS2400W" and "TS2401W" exhibit excellent sliding properties even at high temperatures (120°C). ■ Good flowability during molding - Easy to mold thin-walled and small molded products. *For more details, please refer to the PDF document or feel free to contact us.
![Thermoplastic polyimide resin "Saprime" [Excellent moldability and heat resistance!]](https://image.mono.ipros.com/public/product/image/dfa/2000648186/IPROS77207218319298287415.jpeg?w=280&h=280)
This is a resin that combines excellent moldability and heat resistance, available for use in various fields such as industrial parts, aerospace, automotive, and energy!
Mitsubishi Gas Chemical's "Therplim" is a thermoplastic polyimide resin that exhibits a balanced glass transition temperature and melting point, along with high strength, high heat resistance, high solvent resistance, low dielectric properties, and easy moldability. Samples are available upon request! 【Features】 ■ Excellent moldability with a glass transition temperature (Tg) of 185 degrees and a melting point (Tm) of 323 degrees ■ High strength, high heat resistance, high solvent resistance, low dielectric properties, and easy moldability ■ Suitable for various applications such as melt-extruded films, machining, and injection molding ■ Used in 5G FCCL, test sockets, various sliding compound grades, CFRP, and toughness modifiers *For more details, please request documentation or download the PDF data.
Suprem (TPI) can be used for alloying with various super engineering plastics (TPI, PEI, PES, PPSU, LCP, PEEK).
Introducing the applications of Suprem's super engineering plastics alloy. Suprem is a crystalline super engineering plastic with high heat resistance (Tg: 185°C, Tm: 323°C) and high fluidity, allowing for a high content of fillers and other additives. By leveraging Suprem's characteristics of high heat resistance, crystallinity, low water absorption, and flexibility, improvements in various properties can be expected through alloying with various super engineering plastics. 【Features】 ■ Alloyed product of crystalline thermoplastic polyimide (TPI) resin ■ Crystallinity derived from Suprem is maintained even in alloyed products ■ Expected reinforcement effects through fiber reinforcement *For more details, please refer to the PDF document or feel free to contact us.
Explanation of functional control of polyimide resin (molecular design, surface modification, composite materials) and characteristics (heat resistance, low dielectric constant, transparency, low thermal expansion, etc.)!
○Publication Date: April 24, 2008 ○Format: B5 size, hardcover, 300 pages ○Price: 60,000 yen (excluding tax) → STbook member price: 56,952 yen (excluding tax) ○Contributors: Toshihiko Matsumoto, Tokyo University of the Arts / Yasuji Yamada, Kyoto Institute of Technology / Tomoyuki Suzuki, Nagoya Institute of Technology / Yusuke Nakai, Nagoya Institute of Technology / Akira Iwamori, Kanazawa University / Toshio Ogawa, Kanazawa Institute of Technology / Chikara Takeichi, Toyohashi University of Technology / Yoshiyuki Oishi, Iwate University / Kenichi Fukukawa, Mitsui Chemicals, Inc. / Masatoshi Hasegawa, Toho University / Yuichi Ishida, Japan Aerospace Exploration Agency / Yusuke Tsuda, Kurume National College of Technology / Hiroshi Itaya, Solvay Industries, Inc. / Shinsuke Yamashita, Toray DuPont Co., Ltd. / Naoto Nagai, Niigata Industrial Technology Comprehensive Research Institute / Takashi Oguni, Toray Engineering Co., Ltd. / Takumi Ueno, Hitachi Chemical Co., Ltd. / Gōji Maeda, Toyo Spinning Co., Ltd. / Masatoshi Yuasa, Nippon Steel Chemical Co., Ltd. / Kenichi Okamoto, Yamaguchi University / Takaki Takagata, Yamaguchi University of Science and Technology / And 6 others.
Heat-resistant composite materials / heat-resistant adhesive "Skybond"
Skybond is a varnish based on the most thermally stable aromatic polyimide. It was developed by Monsanto in the United States, and I.S.T acquired the manufacturing and sales rights in April 1996, producing it at the Monsanto Indian Orchard plant in Massachusetts. However, in 2014, the plant was relocated, and it is now produced at the I.S.T New Jersey plant. Skybond can form extremely excellent polyimide prepregs and honeycombs with high thermal resistance and flexibility by combining with high-strength heat-resistant fibers such as glass fibers, carbon fibers, and aramid fibers. It can also be used as a heat-resistant adhesive and sealant. Its applications are mainly in the aerospace field, used in aircraft structural materials, jet engine covers, and wing components. Additionally, taking advantage of its excellent heat resistance, it is used as insulation covers for structures and engines that operate at high temperatures. Heat-resistant bearings and bushes utilizing powder molding properties are also used in a wide range of fields, including office automation equipment. The resin's exceptionally high thermal stability, mechanical and electrical properties, and high reliability are backed by years of proven performance, and its applications continue to expand into aircraft and industrial equipment.
Implementing technology development from design to prototyping and mass production! Viscosity and concentration can be customized.
Our company manufactures polyimide resins. To meet our customers' needs, we offer a range of varnish grades optimized for different applications and characteristics. We can customize viscosity and concentration according to usage conditions. We aim to create products that earn high trust from our customers through technological development from design to prototyping and mass production, achieving high functionality, high quality, and low-cost products. 【Features】 ■ A range of varnish grades optimized for different applications and characteristics ■ Customization of viscosity and concentration according to usage conditions *For more details, please download the PDF or feel free to contact us.
Attention is also drawn to the ability to handle complex lens shapes and high productivity.
The EXTEM XH series developed by SABIC has been increasingly used in optical communication transceiver lenses and optical sensor receiving lenses, which are gaining attention in recent years for applications such as 5G. For the same applications, the company's ULTEM RESIN products (such as ULTEM 1010 and ULTEM DT1810EV) have been widely adopted by many customers and components around the world, but they were not compatible with lead-free soldering processes. This material, which is compatible with that process, is attracting attention for its ability to accommodate complex lens shapes and its high productivity compared to glass and thermosetting resin lenses. Additionally, it has gained recognition as a high-heat-resistant optical thermoplastic resin that was first registered in the Zemax OpticsStudio material database in March 2019, providing designers of optical sensors and lenses with a new groundbreaking material option beyond glass and epoxy resins. [Application Examples] Adopted for infrared sensor lenses used in proximity sensors and gesture recognition in electronic products such as smartphones and gaming consoles. For inquiries and material requests, please visit this site: https://sjpn1971.plabase.com/
Value in die-cast parts and stock shape materials
Did you know that Highheat ULTEM and EXTEM powders can be used as additives for optimizing the manufacturing processes of thermoplastic polyimide (TPI) stock shape products (rods, sheets) as well as die-cast components such as connectors, seal rings, screws, and bearings? Our powders help optimize viscosity, reduce curing time, and minimize product defects such as bubbles. They are also inherently compatible with TPI. Go to our dianhydrides and imides webpage: https://lnkd.in/gtGGF8X For inquiries and requests for materials, please visit this site: https://sjpn1971.plabase.com/
